Polystyrenic resin composition and molded article thereof

ABSTRACT

A polystyrenic resin composition comprising (A) a styrenic polymer composition containing (a) 1 to 99% by weight of a polystyrenic resin having the syndiotactic configuration, (b) 1 to 99% by weight of a polyamide resin, (c) 0.1 to 10% by weight of a compatibilizer which is compatible with component (a) and has a polar group reactive with component (b), and (d) 0 to 50% by weight of a rubbery elastomer and/or a modified rubbery elastomer, (B) specific amounts of a copper compound and an iodine compound, and optionally, specific amounts of (C) a phenolic compound, (D) N,N&#39;-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamide), (E) an ester of thiodipropionic acid or a derivative thereof, (F) a copper inhibitor, and (G) inorganic filler; and a molded article prepared from the polystyrenic resin composition. 
     The polystyrenic resin composition shows excellent resistance to heat aging so that little change in physical properties or color is caused even after exposure to a high temperature for a long time, has excellent toughness, rigidity, heat resistance, and water resistance, and can advantageously be used as a material for various types of industrial product.

TECHNICAL FIELD

The present invention relates to a polystyrenic resin composition and amolded article thereof. More particularly, the present invention relatesto a polystyrenic resin composition which can advantageously be used asa material for industrial products, such as electric and electronicparts, industrial structural materials, automotive parts, electricappliances, and various types of mechanical parts, has excellentmechanical properties, heat resistance, chemical resistance, andproperty for molding, and is particularly excellent in resistance toheat aging; and a molded product thereof.

BACKGROUND ART

Heretofore, it has been disclosed in the specifications of JapanesePatent Application Laid-Open No. Showa 62(1987)-25795, Japanese PatentApplication Laid-Open No. Heisei 1(1989)-279944, Japanese PatentApplication Laid-Open No. Heisei 2(1990)-209938, Japanese PatentApplication Laid-Open No. Heisei 2(1990)-219843, Japanese PatentApplication Laid-Open No. Heisei 3(1991)-126744, and Japanese PatentApplication Laid-Open No. Heisei 4(1992)-269893 that compositions havinga good balance between strength, toughness, heat resistance, chemicalresistance, and processability in molding can be obtained by meltblending a styrenic polymer having the syndiotactic configuration(hereinafter, occasionally referred to as SPS), a polyamide resin, and acompatibilizer for SPS and a polyamide as the main components of thecompositions. By taking advantage of these excellent properties,practical application to products which require strength and heatresistance, such as electric and electronic parts, automobile parts,mechanical parts, and parts of industrial products, is underexamination.

However, the above resin composition has a problem that the resistanceto degradation by oxidation at a high temperature for a long time, i.e.the resistance to heat aging, is not sufficient although the resincompositions have the above excellent characteristics. Therefore,improvement in the resistance to heat aging for a long time has stronglybeen desired in order to increase reliability of the parts describedabove.

For solving the above problem, addition of a phenolic antioxidant(Japanese Patent Application Laid-Open No. Heisei 5(1993)-289290) and acombined use of a phenolic antioxidant and an antioxidant containingsulfur (Japanese Patent Application Laid-Open No. Heisei 6(1994)-384)have been proposed. However, sufficient increase in the resistance toheat aging is not achieved by these technologies. Addition of acombination of a copper compound and an iodine compound and addition ofan amine antioxidant have also been proposed in order to increase theresistance to heat aging of a polyamide. Although the resistance to heataging is increased to some extent by addition of these compounds, theobtained properties are not satisfactory. Moreover, the addition causesother problems that color of the molded products changes with time intoyellow or brown, and that adverse effects of the copper compound ariseto cause corrosion of extruders, molding machines, and the like.

On the other hand, a polyamide resin comprising a phenolic antioxidantand an antioxidant containing sulfur has been proposed. However,satisfactory results have not been obtained by using this technology,either.

Under the above circumstances, the present invention has an object ofproviding a polystyrenic resin composition which shows excellentresistance to heat aging so that decrease in physical properties orchange in color are hardly caused even after exposure to a hightemperature for a long time, has excellent toughness, rigidity, heatresistance, and chemical resistance, and can advantageously be used as amaterial for various types of industrial product.

DISCLOSURE OF THE INVENTION

As the result of extensive studies undertaken by the present inventorsto develop a polystyrenic resin composition having the excellentresistance to heat aging as well as excellent toughness, rigidity, heatresistance, and chemical resistance, it was discovered that a resincomposition of an SPS/polyamide (hereinafter, occasionally referred toas PA) alloy showing no change in color to yellow with time and noadverse effect of a metal and having excellent resistance to heat agingcan be obtained when the resin composition comprises a copper compoundhaving a specific structure and an iodine compound in specific amountsand in a specific ratio of the amounts.

It was also discovered by the present inventors that the resistance toheat aging of the above resin composition of an SPS/polyamide alloy isfurther enhanced when the resin composition comprises a phenoliccompound having a specific structure and/or an ester of thiodipropionicacid or a derivative thereof. It was further discovered that, when theabove resin composition comprises a copper inhibitor, the above resincomposition shows little change in color even when the resin compositioncontains water or is exposed to a high temperature for a long time. Thepresent invention has been completed on the basis of the discoveries.

Accordingly, the present invention has the first object of providing apolystyrenic resin composition comprising (A) a styrenic polymercomposition containing (a) 1 to 99% by weight of a polystyrenic resinhaving the syndiotactic configuration, (b) 1 to 99% by weight of apolyamide resin, (c) 0.1 to 10% by weight of a compatibilizer which iscompatible with component (a) and has a polar group reactive withcomponent (b), and (d) 0 to 50% by weight of a rubbery elastomer and/ora modified rubbery elastomer and (B) a copper compound in such an amountthat content of copper is 1 to 3000 ppm and an iodine compound in suchan amount that ratio by mol of copper to iodine is 1 to 50, the totalcontent of the copper compound and the iodine compound being 5 to 50,000ppm.

The second object of the present invention is to provide a polystyrenicresin composition described above wherein the polystyrenic resincomposition additionally comprises (C) 0.005 to 5.0 parts by weight of aphenolic compound represented by the following general formula (I):##STR1## [wherein R represents methyl group or t-butyl group, Xrepresents a residue group obtained by removing n hydroxy groups from analcohol having 1 to 4 hydroxyl groups, and n represents an integer of 1to 4] per 100 parts by weight of component (A).

The third object of the present invention is to provide polystyrenicresin compositions described above wherein the polystyrenic resincomposition additionally comprises (D) 0.005 to 5.0 parts by weight ofN,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinna mide) per 100parts by weight of component (A).

The fourth object of the present invention is to provide polystyrenicresin compositions described above wherein the polystyrenic resincomposition additionally comprises (E) 0.005 to 5.0 parts by weight ofan ester of thiodipropionic acid or a derivative thereof per 100 partsby weight of component (A).

The fifth object of the present invention is to provide polystyrenicresin compositions described above wherein the polystyrenic resincomposition additionally comprises (F) 0.005 to 5.0 parts by weight of acopper inhibitor per 100 parts by weight of component (A).

The sixth object of the present invention is to provide polystyrenicresin compositions described above wherein the polystyrenic resincomposition additionally comprises (G) 1 to 350 parts by weight ofinorganic filler per 100 parts by weight of the polystyrenic resincomposition excluding the inorganic filler of component (G).

The present invention has another object of providing a molded productprepared from a polystyrenic resin composition described above.

THE MOST PREFERRED EMBODIMENT TO CARRY OUT THE INVENTION

In the resin composition of the present invention, a styrenic polymerhaving the syndiotactic configuration is used as component (a) ofcomponent (A). The syndiotactic configuration of the styrenic polymerhaving the syndiotactic configuration means that the stereochemicalstructure has a highly syndiotactic configuration. In other words,phenyl groups and substituted phenyl groups of the side groups arealternately placed at the opposite positions with respect to the mainchain formed with the carbon-carbon bonds. The tacticity in thestereochemical structure is quantitatively determined by the measurementof the nuclear magnetic resonance using an isotope of carbon (¹³ C-NMR).The tacticity measured by the ¹³ C-NMR method can show the content of asequence in which a specific number of the constituting units are bondedin sequence, such as a diad in which two constituting units are bondedin sequence, a triad in which three constituting units are bonded insequence, and a pentad in which five constituting units are bonded insequence. In the present invention, "the styrenic polymer having thesyndiotactic configuration" means polystyrene, a poly(alkylstyrene), apoly(halogenated styrene), a poly(halogenated alkylstyrene), apoly(alkoxystyrene), a poly(vinylbenzoic acid ester), a hydrogenatedderivative of these polymers, a mixture of these polymers, or acopolymer containing constituting units of these polymers as the maincomponents, which generally has a syndiotacticity of 75% or more,preferably 85% or more, expressed in terms of the content of the racemicdiad, or 30% or more, preferably 50% or more, expressed in terms of thecontent of the racemic pentad. Examples of the poly(alkylstyrene)include poly(methylstyrene), poly(ethylstyrene), poly(isopropylstyrene),poly(tertiary-butylstyrene), poly(phenylstyrene),poly(vinylnaphthalene), poly(vinylstyrene), and the like. Examples ofthe poly(halogenated styrene) include poly(chlorostyrene),poly(bromo-styrene), poly(fluorostyrene), and the like. Examples of thepoly-(halogenated alkylstyrene) include poly(chloromethylstyrene) andthe like. Examples of the poly(alkoxystyrene) includepoly(methoxystyrene), poly(ethoxystyrene), and the like.

Particularly preferable examples of the styrenic polymer described aboveinclude polystyrene, poly(p-methylstyrene), Poly(m-methylstyrene),poly(p-tertiary-butylstyrene), poly(p-chlorostyrene),poly(m-chloro-styrene), poly(p-fluorostyrene), hydrogenated polystyrene,and copolymers containing constituting units of the above polymers.

A single type or a combination of two or more types of the abovestyrenic polymer can be used.

The molecular weight of the styrenic polymer is not particularlylimited. The weight-average molecular weight is preferably 10,000 ormore, more preferably 50,000 or more. The molecular weight distributionis not limited either, and polymers having various molecular weightdistributions can be used. When the weight-average molecular weight isless than 10,000, properties under heating and mechanical properties ofthe obtained composition or the molded products obtained from thecomposition are occasionally decreased, and such a weight-averagemolecular weight is not preferable.

The styrenic polymer having the syndiotactic configuration can beproduced by polymerizing a styrenic monomer (a monomer corresponding tothe above styrenic polymer) in an inert hydrocarbon solvent or in theabsence of solvents by using a titanium compound and a condensationproduct of water and trialkylaluminum as the catalyst (the specificationof Japanese Patent Application Laid-Open No. Showa 62(1987)-187708). Theabove poly(halogenated alkylstyrene) can be produced in accordance withthe process described in the specification of Japanese PatentApplication Laid-Open No. Heisei 1(1989)-46912, and the abovehydrogenated derivative of the polymer described above can be producedin accordance with the process described in the specification ofJapanese Patent Application Laid-Open No. Heisei 1(1989)-178505.

The amount of component (a) is selected in the range of 1 to 99% byweight, preferably in the range of 5 to 95% by weight, more preferably20 to 80% by weight, most preferably 25 to 50% by weight, based on thetotal weight of the resin components. When the amount is less than 1% byweight, the water resistance of the polyamide of component (b) and theeffect of stabilizing the polyamide of component (b) against acids andalkalis are not exhibited. When the amount is more than 99% by weight,the resin composition shows no difference from component (a) alone.

In the resin composition of the present invention, any conventionalpolyamide can be used as the polyamide of component (b) of component(A). Examples of the suitable polyamide include polyamide-4,polyamide-6, polyamide-6,6, polyamide-3,4, polyamide-12, polyamide-11,polyamide-6,10, polyamide obtained from terephthalic acid and4,4'-diamino-hexylmethane, polyamides obtained from azelaic acid, adipicacid, and 2,2-bis(p-cyclohexyl)propane, and polyamides obtained fromadipic acid and m-xylylenediamine.

An aromatic polyamide resin is a polyamide which contains aromatic ringsin the main chain and an amide bond as the repeating unit. The aromaticpolyamide resin can be selected from polymers obtained by the reactionof aromatic diamine components and dicarboxylic acid components inaccordance with a conventional process and polymers obtained by thereaction of diamine components and dicarboxylic acid components havingaromatic rings in accordance with a conventional process.

As the aromatic diamine component, a diamine having a benzene ring, suchas 1,4-diaminobenzene, 1,3-diaminobenzene, 1,2-diamino-benzene,2,4-diaminotoluene, 2,3-diaminotoluene, 2,5-diaminotoluene,2,6-diaminotoluene, o-, m-, or p-xylylenediamine, o-, m-, orp-2,2'-diaminodiethylbenzene, 4,4'-diaminobiphenyl,4,4'-diaminodiphenyl-methane, 4,4'-diaminodiphenyl ether,4,4'-diaminodiphenyl thioether, 4,4'-diaminodiphenyl ketone,4,4'-diaminodiphenyl sulfone, and the like, is used. The aromaticdiamine component may be the above diamine having a benzene ring aloneor may also be a mixture of the above diamine having a benzene ring withother diamines, such as aliphatic diamines, as long as the mixturecontains the diamine having a benzene ring. Of course, a mixture of twoor more types of the diamine having a benzene ring may be used.

Examples of the dicarboxylic acid component include aliphaticdicarboxylic acids, such as glutaric acid, adipic acid, pimellic acid,suberic acid, azelaic acid, sebacic acid, and the like; aromaticcarboxylic acids, such as phthalic acid, isophthalic acid, terephthalicacid, naphthalenedicarboxylic acid, and the like; and esters andchlorides of these dicarboxylic acids. A single type or a combination oftwo or more types of the dicarboxylic acid may be used.

The aromatic polyamide resin can also be obtained by polymerization ofan ω-amino-ω-carboxyl compound having an aromatic ring. Examples of theω-amino-ω-carboxyl compound having an aromatic ring include4-aminophenylcarboxylmethane, 1-(4-amino-phenyl)-2-carboxylethane,3-(4-aminophenyl)-1-carboxylpropane,p-(3-amino-3'-carboxy)dipropylbenzene, and the like.

Preferable examples of the aromatic polyamide resin include polyamidesderived from diamines having a benzene ring and aliphatic dicarboxylicacids. More preferable examples include polyamides derived fromxylylenediamine and adipic acid.

A single type or a combination of two or more types of the polyamide maybe used as component (b). The amount of the polyamide is selected in therange of 1 to 99% by weight, preferably in the range of 5 to 95% byweight, more preferably in the range of 20 to 80% by weight, mostpreferably in the range of 40 to 70% by weight, based on the totalweight of the resin components. When the amount is less than 1% byweight, the properties of the resin composition shows no advantage tothose of the styrenic polymer having the SPS structure alone. When theamount is more than 99% by weight, improvement in the mechanicalproperties and the properties under heating of the styrenic polymerhaving the SPS structure cannot be expected.

In the present invention, a compatibilizer which is compatible withcomponent (a) and has a polar group reactive with component (b) is usedas component (c) of component (A). The compatibilizer is used for thepurpose of increasing the compatibility between component (a) andcomponent (b) and thereby achieving fine dispersion of domains toincrease the strength of the interface.

The polar group reactive with component (b) means a functional groupwhich can react with the polar group in component (b). Specific examplesof such a group include acid anhydride groups, carboxylic acid groups,carboxylic acid ester groups, carboxylic acid halide groups, carboxylicacid amide groups, carboxylic acid salt groups, sulfonic acid group,sulfonic acid ester groups, sulfonic acid chloride group, sulfonic acidamide group, sulfonic acid salt groups, epoxy group, amino group, imidogroup, oxazoline group, and the like.

The property of being compatible with component (a) is exhibited by astructure which has a sequence of units showing compatibility withcomponent (a) in a polymer chain. Examples of such a structure includepolymers having syndiotactic polystyrene, atactic polystyrene, isotacticpolystyrene, styrenic polymers, polyphenylene ether, polyvinyl methylether, or the like as the main chain, a block chain, or a graft chain.

Specific examples of component (c) include modified styrenic polymers,such as styrene-maleic anhydride copolymer (SMA), styrene-glycidylmethacrylate copolymer, polystyrene modified with a carboxylic acid atthe ends, polystyrene modified with epoxy group at the ends, polystyrenemodified with oxazoline group at the ends, polystyrene modified withamine group at the ends, sulfonated polystyrenes, styrenic ionomers,styrene-methyl methacrylate graft polymer, (styrene-glycidylmethacrylate)-methyl methacrylate graft polymer, acrylate-styrene graftpolymers modified with an acid, (styrene-glycidyl methacrylate)-styrenegraft polymer, polybutylene terephthalate-polystyrene graft polymer, SPSmodified with maleic anhydride, SPS modified with fumaric acid, SPSmodified with glycidyl methacrylate, SPS modified with an amine, and thelike; and modified polyphenylene ether polymers, such as (styrene-maleicanhydride)-polyphenylene ether graft polymer, polyphenylene ethermodified with maleic anhydride, polyphenylene ether modified withfumaric acid, polyphenylene ether modified with glycidyl methacrylate,polyphenylene ether modified with an amine, and the like. Among thesecompounds, modified polyphenylene ethers and modified SPS arepreferable.

The above modified polyphenylene ethers can be obtained by modifying aconventional polyphenylene ether with a modifier. The method ofmodification is not limited as long as the modified product can be usedin accordance with the object of the present invention.

The polyphenylene ethers used for the modification are known compounds,and the specifications of U.S. Pat. Nos. 3,306,874, 3,306,875,3,257,357, and 3,257,358 can be referred to for this purpose.Polyphenylene ethers can generally be produced by the oxidative couplingreaction forming homopolymers or copolymers in the presence of acopper-amine complex and one or more types of phenol which aresubstituted at two or three positions. As the copper-amine complex, acopper-amine complex derived from a primary, secondary, or tertiaryamine can be used. Examples of the suitable polyphenylene ether includepoly(2,3-dimethyl-6-ethyl-1,4-phenylene ether),poly(2-methyl-6-chloromethyl-1,4-phenylene ether),poly(2-methyl-6-hydroxyethyl-1,4-phenylene ether),poly(2-methyl-6-n-butyl-1,4-phenylene ether),poly(2-ethyl-6-isopropyl-1,4-phenylene ether),poly(2-ethyl-6-n-propyl-1,4-phenylene ether),poly(2,3,6-trimethyl-1,4-phenylene ether),poly[2-(4'-methylphenyl)-1,4-phenylene ether],poly(2-bromo-6-phenyl-1,4-phenylene ether),poly(2-methyl-6-phenyl-1,4-phenylene ether), poly(2-phenyl-1,4-phenyleneether), poly(2-chloro-1,4-phenylene ether), poly(2-methyl-1,4-phenyleneether), poly(2-chloro-6-ethyl-1,4-phenylene ether),poly(2-chloro-6-bromo- 1,4-phenylene ether),poly(2,6-di-n-propyl-1,4-phenylene ether),poly(2-methyl-6-isopropyl-1,4-phenylene ether),poly(2-chloro-6-methyl-1,4-phenylene ether),poly(2-methyl-6-ethyl-1,4-phenylene ether),poly(2,6-dibromo-1,4-phenylene ether), poly(2,6-dichloro-1,4-phenyleneether), poly(2,6-diethyl-1,4-phenylene ether), andpoly(2,6-dimethyl-1,4-phenylene ether).

Further examples of the suitable polyphenylene ether include copolymers,such as copolymers derived from two or more types of phenol which areused for preparation of the homopolymers described above. Still furtherexamples of the suitable polyphenylene ether include graft copolymersand block copolymers derived from vinylaromatic compounds, such aspolystyrene, and the polyphenylene ether described above. Among thesecompounds, poly(2,6-dimethyl-1,4-phenylene ether) is particularlypreferably used.

As the modifier used for modification of the polyphenylene ethers,compounds having an ethylenic double bond and a polar group in the samemolecule are used. Examples of the modifier include maleic anhydride,maleic acid, fumaric acid, esters of maleic acid, esters of fumaricacid, maleimide, maleimide having substituents on N, salts of maleicacid, salts of fumaric acid, acrylic acid, esters of acrylic acid,acrylamide, salts of acrylic acid, methacrylic acid, esters ofmethacrylic acid, methacrylamide, salts of methacrylic acid, glycidylmethacrylate, and the like. Among these modifiers, maleic anhydride,fumaric acid, and glycidyl methacrylate are particularly preferablyused. A single type or a combination of two or more types of the abovemodifier can be used. The above modified polyphenylene ether can beobtained by bringing the above polyphenylene ether and the abovemodifier into reaction with each other, for example, in the presence ofa solvent or another resin. The process for the modification is notparticularly limited, and a conventional process can be used. Examplesof the conventional process include a process in which the reaction isallowed to proceed by melt kneading the above components at atemperature in the range of 150 to 350° C. using a roll mill, a Banburymixer, an extruder, or the like and a process in which the reaction isallowed to proceed by heating the above components in a solvent, such asbenzene, toluene, and xylene. In order to facilitate the reaction, it iseffective that a radical generating agent, such as benzoyl peroxide,di-t-butyl peroxide, dicumyl peroxide, t-butyl peroxybenzoate,azobisisobutyronitrile, azobisisovaleronitrile,2,3-diphenyl-2,3-dimethylbutane, or the like, is present in the reactionsystem. Among these processes, the process in which the reaction isallowed to proceed by melt kneading the components in the presence of aradical generating agent is preferable.

As component (c), modified SPS having a polar group may also be used.The modified SPS can be obtained by modifying SPS described as component(a) in the above with a modifier. However, the process for obtaining themodified SPS is not limited to this process as long as the modified SPScan be used in accordance with the object of the present invention.

SPS used for the modification is not particularly limited, and polymersdescribed as component (a) in the above can be used. Among thesepolymers, homopolymer of styrene or a copolymer of styrene with asubstituted styrene is preferably used in view of the compatibility withother components. The composition of the copolymer is not particularlylimited. It is preferred that the content of the unit of the substitutedstyrene is 50% by mol or less. When the content is larger than 50% bymol, the compatibility with other components is decreased, and such acontent is not preferable. Examples of the particularly preferablesubstituted styrene include alkylstyrenes, such as methyl styrene,ethylstyrene, isopropylstyrene, tertiary-butylstyrene, vinylstyrene, andthe like; halogenated styrenes, such as chlorostyrene, bromostyrene,fluorostyrene, and the like; halogenated alkylstyrenes, such aschloromethylstyrene, and the like; and alkoxystyrenes, such asmethoxystyrene, ethoxystyrene, and the like. A single type or acombination of two or more types of the substituted styrene can be used.

Polymers having the atactic configuration corresponding to the above SPSmay also be used as long as the used amount is 5% by weight or lessbased on the amount of SPS. When the amount is more than 5% by weight,the heat resistance of the composition is decreased, and such an amountis not preferable.

As the modifier used for modification of SPS, compounds having anethylenic double bond and a polar group in the same molecule can beused. Examples of the modifier include maleic anhydride, maleic acid,fumaric acid, esters of maleic acid, esters of fumaric acid, maleimide,maleimide having substituents on N, salts of maleic acid, salts offumaric acid, acrylic acid, esters of acrylic acid, acrylamide, salts ofacrylic acid, methacrylic acid, esters of methacrylic acid,methacrylamide, salts of methacrylic acid, glycidyl methacrylate, andthe like. Among these modifiers, maleic anhydride, fumaric acid, andglycidyl methacrylate are particularly preferably used. A single type ora combination of two or more types of the above modifier can be used.

The above modified SPS can be obtained by bringing the above SPS and theabove modifier into reaction with each other, for example, in thepresence of a solvent or another resin. The process for the modificationis not particularly limited, and a conventional process can be used.Examples of the conventional process include a process in which thereaction is allowed to proceed by melt kneading the above components ata temperature in the range of 150 to 350° C. using a roll mill, aBanbury mixer, an extruder, or the like and a process in which thereaction is allowed to proceed by heating the above components in asolvent, such as benzene, toluene, and xylene. In order to facilitatethe reaction, it is effective that a radical generating agent, such asbenzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, t-butylperoxybenzoate, azobisisobutyro-nitrile, azobisisovaleronitrile,2,3-diphenyl-2,3-dimethylbutane, or the like, is present in the reactionsystem. Among these processes, the process in which the reaction isallowed to proceed by melt kneading the components in the presence of aradical generating agent is preferable.

Among these modified SPS, SPS modified with maleic anhydride, SPSmodified with fumaric acid, and SPS modified with glycidyl methacrylateare particularly preferably used.

A single type or a combination of two or more types of component (c) canbe used. The content of the polar group in component (c) is in the rangeof 0.01 to 20% by weight, preferably in the range of 0.05 to 10% byweight, more preferably in the range of 0.5 to 5% by weight. When thecontent is less than 0.01% by weight, a large amount of component (c) isrequired for exhibiting the effect of the compatibilizer to causedecrease in the physical properties and the heat resistance of thecomposition, and such a content is not preferable. When the content ismore than 20% weight, the compatibility with component (a) is decreased,and such a content is not preferable either.

The content of component (c) is selected in the range of 0.1 to 10% byweight, preferably in the range of 0.5 to 8% by weight, more preferablyin the range of 1 to 6% by weight, based on the total weight of theresin components. When the content is less than 0.1% by weight, theeffect of improving the toughness is not sufficient. When the content ismore than 10% by weight, the crystallinity of component (a) is decreasedto cause decrease in the heat resistance and the property for molding.Therefore, such contents are not preferable.

In the resin composition of the present invention, a rubbery elastomerand/or a modified rubbery elastomer is used as component (d) ofcomponent (A). The rubbery elastomer is used for increasing the impactresistance and the toughness, such as elongation, of the resincomposition.

Specific examples of the rubbery elastomer used as component (d) includenatural rubber, polybutadiene, polyisoprene, polyisobutylene, neoprene,polysulfide rubber, thiokol rubber, acrylic rubber, urethane rubber,silicone rubber, epichlorohydrin rubber, styrene-butadiene blockcopolymer (SBR), hydrogenated styrene-butadiene block copolymer (SEB),styrene-butadiene-styrene block copolymer (SBS), hydrogenatedstyrene-butadiene-styrene block copolymer (SEBS), styrene-isoprene blockcopolymer (SIR), hydrogenated styrene-isoprene block copolymer (SEP),styrene-isoprene-styrene block copolymer (SIS), hydrogenatedstyrene-isoprene-styrene block copolymer (SEPS), styrene-butadienerandom copolymer, hydrogenated styrene-butadiene random copolymer,styrene-ethylene-propylene random copolymer, styrene-ethylene-butylenerandom copolymer, ethylene-propylene rubber (EPR),ethylene-propylene-diene rubber (EPDM), core-shell type particulateelastomers, such as butadiene-acrylonitrile-styrene core-shell rubber(ABS), methyl methacrylate-butadiene-styrene core-shell rubber (MBS),methyl methacrylate-butyl acrylate-styrene core-shell rubber (MAS),octyl acrylate-butadiene-styrene core-shell rubber (MABS), an alkylacrylate-butadiene-acrylonitrile-styrene core-shell rubber (AABS),butadiene-styrene core-shell rubber (SBR), and core-shell rubberscontaining siloxane such as methyl methacrylate-butyl acrylate-siloxaneand the like, and rubbers obtained by modification of these rubbers.

Among these rubbers, SBR, SBS, SEB, SEBS, SIR, SEP, SIS, SEPS,core-shell rubbers, and rubbers obtained by modification of theserubbers are preferably used.

Specific examples of the modified rubbery elastomer used as component(d) include rubbers obtained by modification of rubbers, such asstyrene-butyl acrylate copolymer, styrene-butadiene block copolymer(SBR), hydrogenated styrene-butadiene block copolymer (SEB),styrene-butadiene-styrene block copolymer (SBS), hydrogenatedstyrene-butadiene-styrene block copolymer (SEBS), styrene-isoprene blockcopolymer (SIR), hydrogenated styrene-isoprene block copolymer (SEP),styrene-isoprene-styrene block copolymer (SIS), hydrogenatedstyrene-isoprene-styrene block copolymer (SEPS), styrene-butadienerandom copolymer, hydrogenated styrene-butadiene random copolymer,styrene-ethylene-propylene random copolymer, styrene-ethylene-butylenerandom copolymer, ethylene-propylene rubber (EPR), andethylene-propylene-diene rubber (EPDM), with a modifier having a polargroup. Among these rubbers, rubbers obtained by modification of SEB,SEBS, SEP, SEPS, EPR, and EPDM, are preferably used. More specifically,SEBS modified with maleic anhydride, SEPS modified with maleicanhydride, EPR modified with maleic anhydride, EPDM modified with maleicanhydride, SEBS modified with epoxy group, SEPS modified with epoxygroup, and the like are preferably used.

A single type or a combination of two or more types of these rubberyelastomer can be used. The content of the rubbery elastomer is selectedin the range of 0 to 50% by weight based on the total weight of theresin components. When the content is more than 50% by weight, themodulus and the heat resistance of the composition are significantlydecreased, and such a content is not preferable.

In the resin composition as the first object of the present invention, acopper compound and an iodine compound are used as component (B).Examples of the copper compound include inorganic copper halides, suchas copper chlorides, copper bromides, and copper iodides; copper saltsof inorganic acids, such as copper sulfates, copper nitrates, and copperphosphates; copper salts of organic acids, such as copper acetates,copper salycilates, copper stearates, copper oleates, copper benzoates,copper formates, copper propionates, copper oxalates, copper sebacates,copper lactates, copper montanoates, copper adipates, copperisophthalates, copper pyrophosphates, and ammonia copper; and complexcompounds of inorganic copper halides with xylylenediamine,benzimidazole, 2-mercaptobenzimidazole, and the like. Among thesecompounds, copper chlorides, copper bromides, copper iodides, and coppernitrates are particularly preferably used.

A single type or a combination of two or more types of the coppercompound can be used. The copper compound is contained in such an amountthat the content of copper in the above resin composition is in therange of 1 to 3,000 ppm, preferably in the range of 5 to 2,000 ppm, morepreferably 20 to 500 ppm. When the amount is less than 1 ppm, sufficientresistance to heat aging cannot be obtained. When the amount is morethan 3,000 ppm, the resistance to heat aging is saturated, and thefinished products show inferior appearance and significant change incolor by absorption of water. Therefore, such amounts are notpreferable.

Examples of the iodine compound include potassium iodide, magnesiumiodide, ammonium iodide, and the like. Elemental iodine can also beused. A single type or a combination of two or more types of the iodinecompound can be used. The iodine compound is contained in such an amountthat the ratio by mol of copper to iodine is 1 to 50, preferably in therange of 1 to 30, more preferably in the range of 5 to 30. When theratio by mol is less than 1, sufficient resistance to heat aging cannotbe obtained, and color of the finished product significantly changes byabsorption of water . When the ratio is more than 50, corrosion ofmetals of extruders, molding machines, and the like as well as corrosionof metals inserted into molded products tend to take place. Therefore,such amounts are not preferable.

The total content of the above copper compound and the above iodinecompound in the above resin composition is in the range of 5 to 50,000ppm, preferably in the range of 10 to 30,000 ppm, more preferably in therange of 100 to 2,000 ppm. When the amount is less than 5 ppm,sufficient resistance to heat aging cannot be obtained. When the amountis more than 50,000 ppm, the electric properties of the resin aredecreased. Therefore, such amounts are not preferable.

In the resin composition as the second object of the present invention,a phenolic compound represented by the following general formula (I):##STR2## [wherein R represents methyl group or t-butyl group, Xrepresents a residue group obtained by removing n hydroxy groups from analcohol having 1 to 4 hydroxyl groups, and n represents an integer of 1to 4] is additionally comprised as component (C). Specific examples ofthe phenolic compound includen-octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate (trade name:IRGANOX 1076, ADEKASTAB AO-50, or SUMILIZER BP-76), triethyleneglycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl) propionate (tradename: IRGANOX 245),1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate] (tradename: IRGANOX 259),2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate](trade name: IRGANOX 1035),3,9-bis[1,1-dimethyl-2-{β-(3-t-butyl-4-hydroxyl-5-methylphenyl)propionyloxy}-ethyl]-2,4,8,10-tetraoxa-spiro[5,5]undecane (trade name:ADEKASTAB AO-80 or SUMILIZER GA-80),pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate](trade name: IRGANOX 1010, ADEKASTAB AO-60, or SUMILIZER BP-101), andthe like. Among these compounds,3,9-bis[1,1-dimethyl-2-{β-(3-t-butyl-4-hydroxyl-5-methylphenyl)propionyloxy}-ethyl]-2,4,8,10-tetraoxaspiro[5,5]undecane,pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate],and n-octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate arepreferable.

A single type or a combination of two or more types of the phenoliccompound can be used. The content in the above resin composition is inthe range of 0.005 to 5.0 parts by weight, preferably in the range of0.01 to 3.0 parts by weight, more preferably in the range of 0.01 to 2.0parts by weight, most preferably in the range of 0.1 to 1.0 parts byweight, per 100 parts by weight of component (A). When the amount isless than 0.005 parts by weight, the physical properties aresignificantly decreased in the heat aging test to show insufficienteffect of the addition. When the amount is more than 5.0 parts byweight, blooming to the surface takes place to cause inferior surfacesand decrease in the surface hardness, the physical properties, and theheat resistance of the molded products, and moreover the effect ofaddition is saturated. Economic disadvantage is also caused. Therefore,such amounts are not preferable.

In the resin composition as the third object of the present invention,N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamide) isadditionally comprised as component (D).

The content of component (D) in the above resin composition is in therange of 0.005 to 5.0 parts by weight, preferably in the range of 0.01to 3.0 parts by weight, more preferably in the range of 0.01 to 2.0parts by weight, most preferably in the range of 0.1 to 1.0 parts byweight, per 100 parts by weight of component (A). When the amount isless than 0.005 parts by weight, the physical properties aresignificantly decreased in the heat aging test to show insufficienteffect of the addition. When the amount is more than 5.0 parts byweight, blooming to the surface takes place to cause inferior surfacesand decrease in the surface hardness, the physical properties, and theheat resistance of the molded products, and moreover the effect ofaddition is saturated. Economic disadvantage is also caused. Therefore,such amounts are not preferable.

In the resin composition as the fourth object of the present invention,an ester of thiodipropionic acid or a derivative thereof is additionallycomprised as component (E). Specific examples of the ester ofthiodipropionic acid and the derivative thereof include dilauryl3,3'-thiodipropionate (trade name: SUMILIZER TPL-R, or YOSHITOMI DLTP),ditridecyl 3,3'-thiodipropionate (trade name: SUMILIZER TL), dimyristyl3,3'-thiodipropionate (trade name: SUMILIZER TPM), distearyl3,3'-thiodipropionate (trade name: SUMILIZER TPS), distearyl3,3'-methyl-3,3'-thiodipropionate, tetrakis[methylene-3-(hexylthio)propionate]methane, tetrakis[methylene-3-(dodecylthio)propionate]-methane (trade name: SUMILIZER TP-D or ADEKASTAB AO-412S),tetrakis[methylene-3-(octadecylthio) propionate]methane, and the like.Among these compounds, tetrakis[methylene-3-(dodecylthio)propionate]methane is particularly preferable.

A single type or a combination of the ester of thiodipropionic acid orthe derivative thereof can be used. The content in the above resincomposition is in the range of 0.005 to 5.0 parts by weight, preferablyin the range of 0.01 to 3.0 parts by weight, more preferably in therange of 0.01 to 2.0 parts by weight, most preferably in the range of0.1 to 1.0 parts by weight, per 100 parts by weight of component (A).When the amount is less than 0.005 parts by weight, the physicalproperties are significantly decreased in the heat aging test to showinsufficient effect of the addition. When the amount is more than 5.0parts by weight, blooming to the surface takes place to cause inferiorsurfaces and decrease in the surface hardness, the physical properties,and the heat resistance of the molded products, and moreover the effectof addition is saturated. Economic disadvantage is also caused.Therefore, such amounts are not preferable.

In the resin composition as the fifth object of the present invention, acopper inhibitor is additionally comprised as component (F). As thecopper inhibitor, any copper inhibitor can be selected from conventionalcopper inhibitors, such as derivatives of oxalic acid, derivatives ofsalycilic acid, derivatives of hydrazine, and the like. Specificexamples of the copper inhibitor include3-(N-salyciloyl)amino-1,2,4-triazole (trade name: ADEKASTAB CDA-1),decamethylenecarboxylic acid disalyciloyl hydrazide (trade name:ADEKASTAB CDA-6), N,N-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionyl]hydrazine (trade name: IRGANOX MD1024),isophthalic acidbis(2-phenoxypropionyl hydrazide) (trade name: CUNOX),N-formyl-N'-salyciloyl hydrazine,2,2-oxamidobis-[ethyl-3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate](trade name: NAUGARD XL-1), oxalyl-bis-benzylidene hydrazide (tradename: INHIBITOR OABH), and the like.

A single type or a combination of two or more types of the copperinhibitor can be used. The content in the above resin composition is inthe range of 0.005 to 5.0 parts by weight, preferably in the range of0.01 to 3.0 parts by weight, more preferably in the range of 0.01 to 2.0parts by weight, most preferably in the range of 0.1 to 1.0 parts byweight, per 100 parts by weight of component (A). When the amount isless than 0.005 parts by weight, color changes significantly byabsorption of water and in the heat aging test to show insufficienteffect of addition. When the amount is more than 5.0 parts by weight,blooming to the surface takes place to cause inferior surfaces anddecrease in the surface hardness, the physical properties, and the heatresistance of the molded products, and moreover the effect of additionis saturated. Economic disadvantage is also caused. Therefore, suchamounts are not preferable.

In the resin composition as the sixth object of the present invention,inorganic filler is additionally comprised as component (G). As theinorganic filler, inorganic fillers treated with a coupling agent on thesurface are preferably used in order to enhance adhesion with thestyrenic resin of component (a) of component (A).

The inorganic filler may have various shapes, such as fiber, granules,powder, and the like. As the filler having the shape of fiber, glassfiber, carbon fiber, wiskers, ceramic fiber, metal fibers, and the likecan be used. Specific examples of the filler having the shape of fiberinclude wiskers, such as boron wisker, alumina wisker, silica wisker,silicon carbide wisker; ceramic fibers, such as gypsum fiber, potassiumtitanate fiber, magnesium sulfate fiber, magnesium oxide fiber, and thelike; and metal fibers, such as copper fiber, aluminum fiber, steelfiber, and the like. As for the form of the filler, the filler may havea form of a cloth, a mat, a cut bundle, short fibers, filaments, orwiskers. When the filler has the form of cut bundles, it is preferredthat the length is 0.05 to 50 mm and the diameter of a fiber is 5 to 20μm. When the filler has the form of a cloth or a mat, the length ispreferably 1 mm or more, more preferably 5 mm or more.

Examples of the filler having a shape of granules or powder includetalc, carbon black, graphite, titanium dioxide, silica, mica, calciumcarbonate, calcium sulfate, barium carbonate, magnesium carbonate,magnesium sulfate, barium sulfate, calcium oxysulfate, tin oxides,alumina, kaolin, silicon carbide, metal powders, glass powder, glassflakes, glass beads, and the like. Among these fillers, glass fillers,such as glass filament, glass fiber, glass roving, glass mat, glasspowder, glass flakes, and glass beads, are particularly preferable.

An inorganic filler, such as those described above, is treated on thesurface with a coupling agent conventionally used for a surfacetreatment, such as a silane coupling agent and a titanium couplingagent, and is used as the inorganic filler treated on the surfacethereof. Specific examples of the silane coupling agent includetriethoxysilane, vinyltris(β-methoxyethoxy)silane,γ-methacryloxypropyltrimethoxy-silane,γ-glycidoxypropyltrimethoxysilane,β-(1,1-epoxycyclohexyl)-ethyltrimethoxysilane,N-β-(aminoethyl)-γ-aminopropyltrimethoxy-silane,N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane,γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysialne,γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane,γ-aminopropyltrimethoxysilane,γ-aminopropyl-tris(2-methoxy-ethoxy)-silane,N-methyl-γ-aminopropyltrimethoxysilane,N-vinylbenzyl-γ-aminopropyltriethoxysilane,triaminopropyltrimethoxysilane, 3-ureydopropyltrimethoxysilane,3-4,5-dihydroimidazolpropyltriethoxy-silane, hexamethyldisilazane,N,O-(bistrimethylsilyl)amide, N,N-bis(trimethylsilyl)urea, and the like.Among these compounds, aminosilanes and epoxysilanes, such asγ-aminopropyltrimethoxysilane,N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane,γ-glycidoxypropyl-trimethoxysilane,β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and the like, areparticularly preferable.

Specific examples of the titanium coupling agent include isopropyltriisostearoyl titanate, isopropyl tridodecylbenzene sulfonyl titanate,isopropyl tris(dioctyl pyrophosphate) titanate, tetraisopropylbis(dioctyl phosphite) titanate, tetraoctyl bis(ditridecyl phosphite)titanate, tetra(1,1-diallyloxymethyl-1-butyl) bis(ditridecyl) phosphitetitanate, bis(dioctyl pyrophosphate) oxyacetate titanate, bis(dioctylpyrophosphate) ethylene titanate, isopropyl trioctanoyl titanate,isopropyl dimethacryl isostearoyl titanate, isopropyl isostearoyldiacryl titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyltricumyl phenyl titanate, isopropyl tri(N-amidoethyl, aminoethyl)titanate, dicumyl phenyloxy acetate titanate, diisostearoyl ethylenetitanate, and the like. Among these compounds, isopropyltri(N-amidoethyl, aminoethyl) titanate is preferable.

The surface treatment of the above filler by using the above couplingagent can be conducted in accordance with a conventional process, andthe process is not particularly limited. A suitable process can beselected in accordance with the shape of the filler, for example, fromthe sizing treatment in which the filler is coated with a solution ofthe above coupling agent in an organic solvent or with a suspension ofthe above coupling agent, i.e., with the so-called sizing agent, the drymixing process using a Henschel mixer, a super mixer, a Redige mixer, ora V-type mixer, the spraying process, the integral blending process, thedry concentrate process, and the like. The sizing treatment, the drymixing process, and the spraying process are preferable among theseprocesses.

A film forming substance for glass may be used in combination with theabove coupling agent. The film forming substance is not particularlylimited. Examples of the film forming substances include polymers suchas polyesters, polyurethanes, epoxy polymers, acrylic polymers, vinylacetate polymers, polyethers, and the like.

In the present invention, organic filler may be used in addition to theabove inorganic filler of component (G). Examples of the organic fillerinclude organic synthetic fibers, natural fibers, and the like. Specificexamples of the organic synthetic fiber include all aromatic polyamidefibers, polyimide fibers, and the like.

A single type or a combination of two or more types of the inorganicfiller can be used. The amount of the inorganic filler is in the rangeof 1 to 350 parts by weight, preferably 5 to 200 parts by weight, basedon 100 parts by weight of the polystyrenic resin composition excludingthe inorganic filler of component (G). When the amount is less than 1part by weight, a sufficient effect as the filler is not obtained. Whenthe amount is more than 350 parts by weight, dispersion is inferior andmolding becomes difficult. Therefore, such amounts are not preferable.

In the resin composition of the present invention, various types ofadditional components, such as additives such as nucleating agents,plasticizers, mold release agents, flame retardants, antistatic agents,foaming agents, pigments, carbon black, processing auxiliary agents,metal soaps, and the like, as well as other thermoplastic resins, may becomprised within the range that the objects of the present invention arenot adversely affected.

The present invention is described in more detail with reference toexamples in the following. However, the present invention is not limitedby the examples.

The amounts of components (B), (C), (E), (F), and (G) of the presentinvention used in the examples and the comparative examples are shown inTables 1 and 2. Physical properties in the examples and the comparativeexamples were evaluated in accordance with the following methods.

(1) The tensile strength and the elongation were measured in accordancewith the method of Japanese Industrial Standard K-7113. A test piece inaccordance with ASTM No. 4 having a thickness of 1 mm or 3 mm was used.The rate of extension was 50 mm/minute for the test piece having athickness of 1 mm and 5 mm/minute for the test piece having a thicknessof 3 mm.

(2) The resistance to heat aging was evaluated by measuring the tensilestrength and the elongation of a test piece after the test piece wasplaced in an air oven kept at a specific constant temperature for 1,000hours.

Preparation Example 1 (Preparation of SPS)

A 2 liter reactor was charged with 1.0 liter of purified styrene and 1mmol of triethylaluminum, and the mixture was heated to 80° C. To theheated mixture, 16.5 ml of a preliminarily mixed catalyst [prepared byusing 90 micromol of pentamethylcylcopentadienyltitanium trimethoxide,90 micromol of dimethylanilinium tetrakis-(pentafluorophenyl) borate,29.1 mmol of toluene, and 1.8 mmol of triisobutylaluminum] was added,and the polymerization was allowed to proceed at 80° C. for 5 hours.After the reaction was finished, the reaction product was repeatedlywashed with methanol and dried to obtain 380 g of a polymer.

The weight-average molecular weight of the obtained polymer was measuredby the gel permeation chromatography by using 1,2,4-trichlorobenzene asthe solvent at 130° C. and found to be 400,000. The ratio of theweight-average molecular weight to the number-average molecular weightwas 2.60. By the measurements of the melting point and the ¹³ C-NMRspectrum, the obtained polymer was confirmed to be SPS.

Preparation Example 2 (Preparation of a modified polyphenylene ether)

One kg of polyphenylene ether (inherent viscosity, 0.47 dl/g, inchloroform at 25° C.), 60 g of maleic anhydride, and 10 g of2,3-dimethyl-2,3-diphenylbutane (a product of NIPPON YUSHI Co., Ltd.;trade name, NOFMER BC) as the radical generating agent were dry blended.The obtained blend was melt kneaded by using a 30 mm twin screw extruderat a rotation speed of 200 rpm at a set temperature of 300° C. Thetemperature of the resin was about 330° C. After being cooled, theobtained strands were formed into pellets to obtain a polyphenyleneether modified with maleic anhydride. For the measurement of the degreeof modification, 1 g of the modified polyphenylene ether obtained abovewas dissolved into ethylbenzene and reprecipitated with methanol. Therecovered polymer was extracted with methanol by a Soxhlet extractor anddried. The degree of modification was obtained from the intensity of theabsorption of carbonyl group in the infrared spectrum of the obtainedpolymer and also by titration of the obtained polymer. The degree ofmodification was found to be 2.0% by weight.

EXAMPLE 1

To a mixture containing 33% by weight of SPS, 60% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), 2%by weight of the polyphenylene ether modified with maleic anhydride, and5% by weight of SEBS modified with maleic anhydride (a product of ASAHIKASEI Co., Ltd.; trade name, MX-072), copper iodide and potassium iodidewere added in such amounts that the content of copper was 50 ppm and thecontent of iodine was 1,000 ppm. After the above components were dryblended by a Henschel mixer, the obtained blend was melt kneaded byusing a twin screw extruder (a product of TOSHIBA KIKAI Co., Ltd.;TEM-35) at a set cylinder temperature of 280° C. to obtain pellets. Fromthe obtained pellets, a test piece having a thickness of 1 mm for thetensile test was prepared by an injection molding machine (a product ofTOSHIBA KIKAI Co., Ltd.; IS55FPA) at a set cylinder temperature of 290°C. The prepared test piece was left standing in an air oven at 150° C.for 1,000 hours, and then the tensile strength and the elongation weremeasured.

The results are shown in Table 2.

EXAMPLE 2

The same procedures as those conducted in Example 1 were conductedexcept that copper iodide and potassium iodide were added in suchamounts that the content of copper was 50 ppm and the content of iodinewas 1,500 ppm.

The results are shown in Table 2.

EXAMPLE 3

The same procedures as those conducted in Example 1 were conductedexcept that copper iodide and potassium iodide were added in suchamounts that the content of copper was 150 ppm and the content of iodinewas 1,500 ppm.

The results are shown in Table 2.

EXAMPLE 4

The same procedures as those conducted in Example 1 were conductedexcept that copper iodide and potassium iodide were added in suchamounts that the content of copper was 300 ppm and the content of iodinewas 1,500 ppm.

The results are shown in Table 2.

EXAMPLE 5

The same procedures as those conducted in Example 1 were conductedexcept that copper acetate and potassium iodide were added in place ofcopper iodide and potassium iodide in such amounts that the content ofcopper was 50 ppm and the content of iodine was 1,500 ppm.

The results are shown in Table 2.

EXAMPLE 6

The same procedures as those conducted in Example 1 were conductedexcept that copper(I) chloride and potassium iodide were added in placeof copper iodide and potassium iodide in such amounts that the contentof copper was 50 ppm and the content of iodine was 1,500 ppm.

The results are shown in Table 2.

EXAMPLE 7

The same procedures as those conducted in Example 1 were conductedexcept that copper(I) bromide and potassium iodide were added in placeof copper iodide and potassium iodide in such amounts that the contentof copper was 50 ppm and the content of iodine was 1,500 ppm.

The results are shown in Table 2.

EXAMPLE 8

To a mixture containing 33% by weight of SPS, 60% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), 2%by weight of the polyphenylene ether modified with maleic anhydride, and5% by weight of SEBS modified with maleic anhydride (a product of ASAHIKASEI Co., Ltd.; trade name, MX-072), copper iodide and potassium iodidewere added in such amounts that the content of copper was 50 ppm and thecontent of iodine was 1,500 ppm. To 100 parts by weight of the total ofthe above components, 0.3 parts by weight of IRGANOX 1010 (a product ofCIBA GEIGY Co., Ltd.) was added as the phenolic compound. After all thecomponents were dry blended by a Henschel mixer, the obtained blend wasmelt kneaded by using a twin screw extruder (a product of TOSHIBA KIIAICo., Ltd.; TEM-35) at a set cylinder temperature of 280° C. to obtainpellets. From the obtained pellets, a test piece having a thickness of 1mm for the tensile test was prepared by an injection molding machine (aproduct of TOSHIBA KIKAI Co., Ltd.; IS55FPA) at a set cylindertemperature of 290° C. The prepared test piece was left standing in anair oven at 150° C. for 1,000 hours, and then the tensile strength andthe elongation were measured.

The results are shown in Table 2.

EXAMPLE 9

The same procedures as those conducted in Example 8 were conductedexcept that 0.3 parts by weight of ADEKASTAB AO-80 (a product of ASAHIDENKA Co., Ltd.) was added as the phenolic compound in place of 0.3parts by weight of IRGANOX 1010 (a product of CIBA GEIGY Co., Ltd.).

The results are shown in Table 2.

EXAMPLE 10

The same procedures as those conducted in Example 8 were conductedexcept that 0.3 parts by weight of IRGANOX 1098 (a product of CIBA GEIGYCo., Ltd.) was added as the phenolic compound in place of 0.3 parts byweight of IRGANOX 1010 (a product of CIBA GEIGY Co., Ltd.).

The results are shown in Table 2.

EXAMPLE 11

To a mixture containing 33% by weight of SPS, 60% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), 2%by weight of the polyphenylene ether modified with maleic anhydride, and5% by weight of SEBS modified with maleic anhydride (a product of ASAHIKASEI Co., Ltd.; trade name, MX-072), copper iodide and potassium iodidewere added in such amounts that the content of copper was 50 ppm and thecontent of iodine was 1,500 ppm. To 100 parts by weight of the total ofthe above components, 0.3 parts by weight of IRGANOX 1010 (a product ofCIBA GEIGY Co., Ltd.) as the phenolic compound and 0.3 parts by weightof SUMILIZER TP-D (a product of SUMITOMO KAGAKU Co., Ltd.) as the esterof thiodipropionic acid or the derivative thereof were added. After allthe components were dry blended by a Henschel mixer, the obtained blendwas melt kneaded by using a twin screw extruder (a product of TOSHIBAKIKAI Co., Ltd.; TEM-35) at a set cylinder temperature of 280° C. toobtain pellets. From the obtained pellets, a test piece having athickness of 1 mm for the tensile test was prepared by an injectionmolding machine (a product of TOSHIBA KIKAI Co., Ltd.; IS55FPA) at a setcylinder temperature of 290° C. The prepared test piece was leftstanding in an air oven at 150° C. for 1,000 hours, and then the tensilestrength and the elongation were measured.

The results are shown in Table 2.

EXAMPLE 12

The same procedures as those conducted in Example 11 were conductedexcept that 0.3 parts by weight of ADEKASTAB AO-80 (a product of ASAHIDENKA Co., Ltd.) as the phenolic compound and 0.3 parts by weight ofSUMILIZER TP-D (a product of SUMITOMO KAGAKU Co., Ltd.) as the ester ofthiodipropionic acid or the derivative thereof were added in place of0.3 parts by weight of IRGANOX 1010 (a product of CIBA GEIGY Co., Ltd.)and 0.3 parts by weight of SUMILIZER TP-D (a product of SUMITOMO KAGAKUCo., Ltd.).

The results are shown in Table 2.

EXAMPLE 13

The same procedures as those conducted in Example 11 were conductedexcept that 0.3 parts by weight of IRGANOX 1098 (a product of CIBA GEIGYCo., Ltd.) as the phenolic compound and 0.3 parts by weight of SUMILIZERTP-D (a product of SUMITOMO KAGAKU Co., Ltd.) as the ester ofthiodipropionic acid or the derivative thereof were added in place of0.3 parts by weight of IRGANOX 1010 (a product of CIBA GEIGY Co., Ltd.)and 0.3 parts by weight of SUMILIZER TP-D (a product of SUMITOMO KAGAKUCo., Ltd.).

The results are shown in Table 2.

EXAMPLE 14

To a mixture containing 33% by weight of SPS, 60% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), 2%by weight of the polyphenylene ether modified with maleic anhydride, and5% by weight of SEBS modified with maleic anhydride (a product of ASAHIKASEI Co., Ltd.; trade name, MX-072), copper iodide and potassium iodidewere added in such amounts that the content of copper was 50 ppm and thecontent of iodine was 1,500 ppm. To 100 parts by weight of the total ofthe above components, 0.3 parts by weight of IRGANOX MD1024 (a productof CIBA GEIGY Co., Ltd.) was added as the copper inhibitor. After allthe components were dry blended by a Henschel mixer, the obtained blendwas melt kneaded by using a twin screw extruder (a product of TOSHIBAKIKAI Co., Ltd.; TEM-35) at a set cylinder temperature of 280° C. toobtain pellets. From the obtained pellets, a test piece having athickness of 1 mm for the tensile test was prepared by an injectionmolding machine (a product of TOSHIBA KIKAI Co., Ltd.; IS55EPN) at a setcylinder temperature of 290° C. The prepared test piece was leftstanding in an air oven at 150° C. for 1,000 hours, and then the tensilestrength and the elongation were measured.

The results are shown in Table 2.

EXAMPLE 15

The same procedures as those conducted in Example 14 were conductedexcept that 0.3 parts by weight of ADEKASTAB CDA-6 (a product of ASAHIDENKA Co., Ltd.) was added as the copper inhibitor in place of 0.3 partsby weight of IRGANOX MD1024 (a product of CIBA GEIGY Co., Ltd.).

The results are shown in Table 2.

EXAMPLE 16

The same procedures as those conducted in Example 14 were conductedexcept that 0.3 parts by weight of NAUGARD XL-1 (a product of UNIROYALCHEMICAL Co., Ltd.) was added as the copper inhibitor in place of 0.3parts by weight of IRGANOX MD1024 (a product of CIBA GEIGY Co., Ltd.).

The results are shown in Table 2.

EXAMPLE 17

To a mixture containing 33% by weight of SPS, 60% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), 2%by weight of the polyphenylene ether modified with maleic anhydride, and5% by weight of SEBS modified with maleic anhydride (a product of ASAHIKASEI Co., Ltd.; trade name, MX-072), copper iodide and potassium iodidewere added in such amounts that the content of copper was 50 ppm and thecontent of iodine was 1,500 ppm. To 100 parts by weight of the total ofthe above components, 0.3 parts by weight of IRGANOX 1010 (a product ofCIBA GEIGY Co., Ltd.) as the phenolic compound, 0.3 parts by weight ofSUMILIZER TP-D (a product of SUMITOMO KAGAKU Co., Ltd.) as the ester ofthiodipropionic acid or the derivative thereof, and 0.3 parts by weightof IRGANOX MD1024 (a product of CIBA GEIGY Co., Ltd.) as the copperinhibitor were added. All the components were melt kneaded by using atwin screw extruder (a product of TOSHIBA KIKAI Co., Ltd.; TEM-35) at aset cylinder temperature of 280° C. to obtain pellets. From the obtainedpellets, a test piece having a thickness of 1 mm for the tensile testwas prepared by an injection molding machine (a product of TOSHIBA KIKAICo., Ltd.; IS55EPN) at a set cylinder temperature of 290° C. Theprepared test piece was left standing in an air oven at 150° C. for1,000 hours, and then the tensile strength and the elongation weremeasured.

The results are shown in Table 2.

COMPARATIVE EXAMPLE 1

A mixture containing 33% by weight of SPS, 60% by weight of a polyamide66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), 2% by weightof the polyphenylene ether modified with maleic anhydride, and 5% byweight of SEBS modified with maleic anhydride (a product of ASAHI KASEICo., Ltd.; trade name, MX-072) was dry blended by a Henschel mixer. Theobtained blend was melt kneaded by using a twin screw extruder (aproduct of TOSHIBA KIKAI Co., Ltd.; TEM-35) at a set cylindertemperature of 280° C. to obtain pellets. From the obtained pellets, atest piece having a thickness of 1 mm for the tensile test was preparedby an injection molding machine (a product of TOSHIBA KIKAI Co., Ltd.;IS55FPA) at a set cylinder temperature of 290° C. The prepared testpiece was left standing in an air oven at 150° C. for 1,000 hours, andthen the tensile strength and the elongation were measured.

The results are shown in Table 2.

COMPARATIVE EXAMPLE 2

To a mixture containing 33% by weight of SPS, 60% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), 2%by weight of the polyphenylene ether modified with maleic anhydride, and5% by weight of SEBS modified with maleic anhydride (a product of ASAHIKASEI Co., Ltd.; trade name, MX-072), copper iodide was added in such anamount that the content of copper was 50 ppm. After the above componentswere dry blended by a Henschel mixer, the obtained blend was meltkneaded by using a twin screw extruder (a product of TOSHIBA KIKAI Co.,Ltd.; TEM-35) at a set cylinder temperature of 280° C. to obtainpellets. From the obtained pellets, a test piece for the tensile testwas prepared by an injection molding machine (a product of TOSHIBA KIKAICo., Ltd.; IS55EPN) at a set cylinder temperature of 290° C. Theprepared test piece was left standing in an air oven at 150° C. for1,000 hours, and then the tensile strength and the elongation weremeasured.

The results are shown in Table 2.

COMPARATIVE EXAMPLE 3

To a mixture containing 33% by weight of SPS, 60% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), and2% by weight of the polyphenylene ether modified with maleic anhydride,and 5% by weight of SEBS modified with maleic anhydride (a product ofASAHI KASEI Co., Ltd.; trade name, MX-072), copper iodide and potassiumiodide were added in such amounts that the content of copper was 300 ppmand the content of iodine was 150 ppm. After the above components weredry blended by a Henschel mixer, the obtained blend was melt kneaded byusing a twin screw extruder (a product of TOSHIBA KIKAI Co., Ltd.;TEM-35) at a set cylinder temperature of 280° C. to obtain pellets. Fromthe obtained pellets, a test piece having a thickness of 1 mm for thetensile test was prepared by an injection molding machine (a product ofTOSHIBA KIKAI Co., Ltd.; IS55FPA) at a set cylinder temperature of 290°C. The prepared test piece was left standing in an air oven at 150° C.for 1,000 hours, and then the tensile strength and the elongation weremeasured.

The results are shown in Table 2.

EXAMPLE 18

To a mixture containing 44% by weight of SPS, 50% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), and6% by weight of the polyphenylene ether modified with maleic anhydride,copper iodide and potassium iodide were added in such amounts that thecontent of copper was 50 ppm and the content of iodine was 1,500 ppm.After the above components were dry blended by a Henschel mixer, theobtained blend was melt kneaded by using a twin screw extruder (aproduct of TOSHIBA KIKAI Co., Ltd.; TEM-35) at a set cylindertemperature of 280° C. while glass fiber (a product of ASAHI FIBER Co.,Ltd.; 03JAFT2A) was added by side feeding to obtain pellets. From theobtained pellets, a test piece having a thickness of 3 mm for thetensile test was prepared by an injection molding machine (a product ofTOSHIBA KIKAI Co., Ltd.; IS55FPA) at a set cylinder temperature of 290°C. The prepared test piece was left standing in an air oven at 160° C.for 1,000 hours, and then the tensile strength and the elongation weremeasured.

The results are shown in Table 2.

EXAMPLE 19

To a mixture containing 44% by weight of SPS, 50% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), and6% by weight of the polyphenylene ether modified with maleic anhydride,copper iodide and potassium iodide were added in such amounts that thecontent of copper was 50 ppm and the content of iodine was 1,500 ppm. To100 parts by weight of the total of the above components, 0.3 parts byweight of IRGANOX 1098 (a product of CIBA GEIGY Co., Ltd.) was added asthe phenolic compound. After the above components were dry blended by aHenschel mixer, the obtained blend was melt kneaded by using a twinscrew extruder (a product of TOSHIBA KIKAI Co., Ltd.; TEM-35) at a setcylinder temperature of 280° C. while glass fiber (a product of ASAHIFIBER Co., Ltd.; 03JAFT2A) was added by side feeding to obtain pellets.From the obtained pellets, a test piece having a thickness of 3 mm forthe tensile test was prepared by an injection molding machine (a productof TOSHIBA KIKAI Co., Ltd.; IS55FPA) at a set cylinder temperature of290° C. The prepared test piece was left standing in an air oven at 160°C. for 1,000 hours, and then the tensile strength and the elongationwere measured.

The results are shown in Table 2.

EXAMPLE 20

To a mixture containing 44% by weight of SPS, 50% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), and6% by weight of the polyphenylene ether modified with maleic anhydride,copper iodide and potassium iodide were added in such amounts that thecontent of copper was 50 ppm and the content of iodine was 1,500 ppm. To100 parts by weight of the total of the above components, 0.3 parts byweight of IRGANOX 1010 (a product of CIBA GEIGY Co., Ltd.) as thephenolic compound and 0.3 parts by weight of SUMILIZER TP-D (a productof SUMITOMO KAGAKU Co., Ltd.) as the ester of thiodipropionic acid orthe derivative thereof were added. After the components were dry blendedby a Henschel mixer, the obtained blend was melt kneaded by using a twinscrew extruder (a product of TOSHIBA KIKAI Co., Ltd.; TEM-35) at a setcylinder temperature of 280° C. while glass fiber (a product of ASAHIFIBER Co., Ltd.; 03JAFT2A) was added by side feeding to obtain pellets.From the obtained pellets, a test piece having a thickness of 3 mm forthe tensile test was prepared by an injection molding machine (a productof TOSHIBA KIKAI Co., Ltd.; IS55FPA) at a set cylinder temperature of290° C. The prepared test piece was left standing in an air oven at 160°C. for 1,000 hours, and then the tensile strength and the elongationwere measured.

The results are shown in Table 2.

COMPARATIVE EXAMPLE 4

A mixture containing 44% by weight of SPS, 50% by weight of a polyamide66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), and 6% byweight of the polyphenylene ether modified with maleic anhydride was dryblended by a Henschel mixer. The obtained blend was melt kneaded byusing a twin screw extruder (a product of TOSHIBA KIKAI Co., Ltd.;TEM-35) at a set cylinder temperature of 280° C. while glass fiber (aproduct of ASAHI FIBER Co., Ltd.; 03JAFT2A) was added by side feeding toobtain pellets. From the obtained pellets, a test piece having athickness of 3 mm for the tensile test was prepared by an injectionmolding machine (a product of TOSHIBA KIKAI Co., Ltd.; IS55FPA) at a setcylinder temperature of 290° C. The prepared test piece was leftstanding in an air oven at 160° C. for 1,000 hours, and then the tensilestrength and the elongation were measured.

The results are shown in Table 2.

COMPARATIVE EXAMPLE 5

To a mixture containing 44% by weight of SPS, 50% by weight of apolyamide 66 (a product of UBE KOSAN Co., Ltd.; trade name, 2015B), and6% by weight of the polyphenylene ether modified with maleic anhydride,copper(I) chloride was added in such an amount that the content ofcopper was 50 ppm. After the components were dry blended by a Henschelmixer, the obtained blend was melt kneaded by using a twin screwextruder (a product of TOSHIBA KIKAI Co., Ltd.; TEM-35) at a setcylinder temperature of 280° C. while glass fiber (a product of ASAHIFIBER Co., Ltd.; 03JAFT2A) was added by side feeding to obtain pellets.From the obtained pellets, a test piece having a thickness of 3 mm forthe tensile test was prepared by an injection molding machine (a productof TOSHIBA KIKAI Co., Ltd.; IS55FPA) at a set cylinder temperature of290° C. The prepared test piece was left standing in an air oven at 160°C. for 1,000 hours, and then the tensile strength and the elongationwere measured.

The results are shown in Table 2.

                                      TABLE 1-1                                   __________________________________________________________________________                               (C)                                                     phenolic (E) ester                                                         (B)   compound of thiodipro-                                                copper compound    content                                                                           Cu/I   amount                                                                            pionic acid.sup..sup.4)                                 content of Cu                                                                        of I                                                                              ratio  part                                                                              part                                          type ppm ppm by mol type by wt. by wt.                                      __________________________________________________________________________    Example                                                                         1 Cu iodide 50 1000 20 --  -- --                                              2 Cu iodide 50 1500 30 -- -- --                                               3 Cu iodide 150  1500 10 -- -- --                                             4 Cu iodide 300  1500  5 -- -- --                                             5 Cu acetate 50 1500 30 -- -- --                                              6 Cu(I) chloride 50 1500 30 -- -- --                                          7 Cu(I) bromide 50 1500 30 -- -- --                                           8 Cu iodide 50 1500 30 .sup.1) 0.3 --                                         9 Cu iodide 50 1500 30 .sup.2) 0.3 --                                         10  Cu iodide 50 1500 30 .sup.3) 0.3 --                                       11  Cu iodide 50 1500 30 .sup.1) 0.3 0.3                                      12  Cu iodide 50 1500 30 .sup.2) 0.3 0.3                                      13  Cu iodide 50 1500 30 .sup.3) 0.3 0.3                                    __________________________________________________________________________     Notes:                                                                        .sup.1) IRGANOX 1010                                                          .sup.2) ADEKASTAB AO80                                                        .sup.3) IRGANOX 1098                                                          .sup.4) SUMILIZER TPD                                                    

                                      TABLE 1-2                                   __________________________________________________________________________                                (C)                                                    phenolic (E) ester                                                         (B)   compound of thiodipro-                                                copper compound     content                                                                           Cu/I   amount                                                                            pionic acid.sup..sup.4)                                 content of Cu                                                                        of I                                                                              ratio  part                                                                              part                                         type ppm ppm by mol type by wt. by wt.                                      __________________________________________________________________________    Example                                                                         14 Cu iodide 50 1500 30 --  -- --                                             15 Cu iodide 50 1500 30 -- -- --                                              16 Cu iodide 50 1500 30 -- -- --                                              17 Cu iodide 50 1500 30 .sup.1) 0.3 0.3                                       Comparative                                                                   Example                                                                        1 -- -- -- -- -- -- --                                                        2 Cu(I) chloride 50 -- -- -- -- --                                            3 Cu iodide 300   150 0.5 -- -- --                                           Example                                                                       18 Cu iodide 50 1500 30 -- -- --                                              19 Cu iodide 50 1500 30 .sup.3) 0.3 --                                        20 Cu iodide 50 1500 30 .sup.1) 0.3 0.3                                       Comparative                                                                   Example                                                                        4 -- -- -- -- -- -- --                                                        5 Cu(I) chloride 50 -- -- -- -- --                                         __________________________________________________________________________     Notes:                                                                        .sup.1) IRGANOX 1010                                                          .sup.3) IRGANOX 1098                                                          .sup.4) SUMILIZER TPD                                                    

                                      TABLE 2-1                                   __________________________________________________________________________    (F)         (G) properties   resistance                                         copper GF after change to                                                     inhibitor filled molding in color.sup.5) heat aging                                 amount                                                                            amount                                                                            tensile                                                                           elong-                                                                            after                                                                              tensile                                                                           elong-                                          part % strength ation absorption strength ation change                       type by wt. by wt. MPa mm of water.sup.4) MPa mm in color.sup.5)            __________________________________________________________________________    Example                                                                         1 --  -- -- 59 27 ◯ 57 10 Δ                                 2 -- -- -- 61 25 ◯ 60 11 Δ                                  3 -- -- -- 58 26 ◯ 59 14 Δ                                  4 -- -- -- 59 27 ◯ 57 15 Δ                                  5 -- -- -- 60 26 ◯ 61  9 Δ                                  6 -- -- -- 59 25 ◯ 58 10 Δ                                  7 -- -- -- 59 27 ◯ 60 10 Δ                                  8 -- -- -- 61 27 ◯ 60 16 Δ                                  9 -- -- -- 61 26 ◯ 60 16 Δ                                  10  -- -- -- 60 27 ◯ 57 19 Δ                                11  -- -- -- 59 27 ◯ 60 24 Δ                                12  -- -- -- 59 25 ◯ 60 23 Δ                                13  -- -- -- 61 26 ◯ 59 24 Δ                              __________________________________________________________________________     Notes:                                                                        .sup.4) Test conducted by dipping into water at 100° C. for 12         hours.                                                                        .sup.5) ⊚: no change in color; ◯: slight           change; Δ: change in color; ×: significant change in color   

                                      TABLE 2-2                                   __________________________________________________________________________    (F)          (G) properties   resistance                                        copper GF after change to                                                     inhibitor filled molding in color.sup.5) heat aging                                  amount                                                                            amount                                                                            tensile                                                                           elong-                                                                            after                                                                              tensile                                                                           elong-                                         part % strength ation absorption strength ation change                       type by wt. by wt. MPa mm of water.sup.4) MPa mm in color.sup.5)            __________________________________________________________________________    Example                                                                         14 .sup.6) 0.3 -- 59 26 ∘  61 22 ◯                    15 .sup.7) 0.3 -- 60 26 ⊚  61 12 ◯                 16 .sup.8) 0.3 -- 59 25 ⊚  60 12 ◯                 17 .sup.6) 0.3 -- 59 25 ⊚  60 24 ⊚                                                   Comparative                              Example                                                                        1 -- -- -- 61 27 ⊚  26 1.1 ×                             2 -- -- -- 58 27 ×  40 1.7 ×                                      3 -- -- -- 61 26 ×  48 3.9 ×                                     Example                                                                       18 -- -- 30 175  3.0 ◯ 159 2.6 Δ                            19 -- -- 30 173  3.1 ◯ 167 2.8 ◯                      20 -- -- 30 176  3.0 ◯ 172 2.9 ◯                      Comparative                                                                   Example                                                                        4 -- -- 30 175  3.0 ⊚ 114 1.7 ×                          5 -- -- 30 174  3.0 × 140 1.9 ×                                __________________________________________________________________________     Notes:                                                                        .sup.4) Test conducted by dipping into water at 100° C. for 12         hours.                                                                        .sup.5) ⊚: no change in color; ◯: slight chang     in color; Δ: change in color; ×: significant change in color      .sup.6) IRGANOX MD1024                                                        .sup.7) ADEKASTAB CDA6                                                        .sup.8) NAUGARD XL1                                                      

We claim:
 1. A composition comprising:(A) a styrenic polymer compositioncontaining(a) 1 to 99% by weight of a styrenic polymer havingsyndiotactic configuration, selected from the group consisting ofpolystyrene, poly(alkylstyrene), poly(halogenated styrene),poly(halogenated alkylstyrene), poly(alkoxystyrene), poly(vinylbenzoicacid ester), a hydrogenated derivative of these polymer, a mixture ofthese polymers and a copolymer containing constituting units of thesepolymers as the main components; (b) 1 to 99% by weight of a polyamideresin, (c) 0.1 to 10% by weight of a compatibilizer which is compatiblewith component (a) and has a polar group reactive with component (b),and (d) 0 to 50% by weight of an elastomer selected from the groupconsisting of a rubbery elastomer, a modified rubbery elastomer and amixture thereof; and (B) a copper compound in such an amount thatcontent of copper is 1 to 3000 ppm and an iodine compound in such anamount that ratio by mnol of copper to iodine is 1 to 50, the totalcontent of the copper compound and the iodine compound being 5 to 50,000ppm.
 2. The composition according to claim 1 wherein the compositionadditionally comprises (C) 0.005 to 5.0 parts by weight, per 100 partsbv weight of component (A), of a phenolic compound represented by thefollowing general formula (I): ##STR3## wherein R represents methylgroup or t-butyl group, X represents a residue group obtained byremoving n hydroxy groups from an alcohol having 1 to 4 hydroxyl groups,and n represents an integer of 1 to
 4. 3. A polystyrenic resincomposition according to claim 1 wherein the polystyrenic resincomposition additionally comprises (D) 0.005 to 5.0 parts by weight ofN,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamide) per 100parts by weight of component (A).
 4. A polystyrenic resin compositionaccording to claim 2 wherein the polystyrenic resin compositionadditionally comprises (D) 0.005 to 5.0 parts by weight ofN,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamide) per 100parts by weight of component (A).
 5. A polystyrenic resin compositionaccording to claim 1 wherein the polystyrenic resin compositionadditionally comprises (E) 0.005 to 5.0 parts by weight of an ester ofthiodipropionic acid or a derivative thereof per 100 parts by weight ofcomponent (A).
 6. A polystyrenic resin composition according to claim 2wherein the polystyrenic resin composition additionally comprises (E)0.005 to 5.0 parts by weight of an ester of thiodipropionic acid or aderivative thereof per 100 parts by weight of component (A).
 7. Apolystyrenic resin composition according to claim 3 wherein thepolystyrenic resin composition additionally comprises (E) 0.005 to 5.0parts by weight of an ester of thiodipropiojnic acid or a derivativethereof per 100 parts by weight of component (A).
 8. A polystyrenicresin composition according to claim 4 wherein the polystyrenic resincomposition additionally comprises (E) 0.005 to 5.0 parts by weight ofan ester of thiodipropionic acid or a derivative thereof per 100 partsby weight of component (A).
 9. A polystyrenic resin compositionaccording to claim 1 wherein the polystyrenic resin compositionadditionally comprises (F) 0.005 to 5.0 parts by weight of a copperinhibitor per 100 parts by weight of component (A).
 10. A polystyrenicresin composition according to claim 2 wherein the polystyrenic resincomposition additionally comprises (F) 0.005 to 5.0 parts by weight of acopper inhibitor per 100 parts by weight of component (A).
 11. Apolystyrenic resin composition according to claim 3 wherein thepolystyrenic resin composition additionally comprises (F) 0.005 to 5.0parts by weight of a copper inhibitor per 100 parts by weight ofcomponent (A).
 12. A polystyrenic resin composition according to claim 4wherein the polystyrenic resin composition additionally comprises (F)0.005 to 5.0 parts by weight of a copper inhibitor per 100 parts byweight of component (A).
 13. A polystyrenic resin composition accordingto claim 5 wherein the polystyrenic resin composition additionallycomprises (F) 0.005 to 5.0 parts by weight of a copper inhibitor per 100parts by weight of component (A).
 14. A polystyrenic resin compositionaccording to claim 6 wherein the polystyrenic resin compositionadditionally comprises (F) 0.005 to 5.0 parts by weight of a copperinhibitor per 100 parts by weight of component (A).
 15. A polystyrenicresin composition according to claim 7 wherein the polystyrenic resincomposition additionally comprises (F) 0.005 to 5.0 parts by weight of acopper inhibitor per 100 parts by weight of component (A).
 16. Apolystyrenic resin composition according to claim 8 wherein thepolystyrenic resin composition additionally comprises (F) 0.005 to 5.0parts by weight of a copper inhibitor per 100 parts by weight ofcomponent (A).
 17. A polystyrenic resin composition according to claim 1wherein the polystyrenic resin composition additionally comprises (G) 1to 350 parts by weight of inorganic filler per 100 parts by weight ofthe polystyrenic resin composition excluding the inorganic filler ofcomponent (G).
 18. A molded product prepared from a polystyrenic resincomposition described in claim 1.